Samsung's Exynos processor (Samsung Electronics)
Samsung's Exynos processor (Samsung Electronics)

Samsung Electronics' next-generation Exynos 2700 mobile processor scored nearly 20 percent higher than Qualcomm's top-end Snapdragon chip in an internal multicore CPU test, ahead of its expected debut in the Galaxy S27 series early next year.

The results came from recent in-house benchmark tests comparing the Exynos 2700 with Qualcomm's Snapdragon 8 Elite Extreme Gen 6, which powers Xiaomi's 18 Pro Max, according to industry sources Sunday.

In Geekbench 6.5, the Exynos 2700 posted a multicore CPU score of around 13,000, compared with roughly 11,000 for Qualcomm's Extreme chip. The Samsung processor also scored about 15 percent higher in Geekbench 7.0 multicore tests.

Qualcomm has introduced two versions of its latest flagship mobile chipset: the top-end Snapdragon 8 Elite Extreme Gen 6 and the standard Snapdragon 8 Elite Gen 6. The Extreme variant powers the Xiaomi 18 Pro Max, while the standard version is used in the Xiaomi 18 Pro.

Against the standard Snapdragon chip, the Exynos 2700 scored 44 percent higher in Geekbench 6.5 multicore tests and 36 percent higher in Geekbench 7.0.

The Samsung chip also outperformed Qualcomm's Extreme model in graphics tests, which measure capabilities important for gaming and video playback.

In a test of peak graphics performance under demanding gaming conditions using advanced graphics technologies, the Exynos 2700 scored about 20 percent higher than the Qualcomm chip. It also held a roughly 5 percent lead in a separate test measuring basic graphics processing capabilities in high-end 3D games.

Samsung's System LSI business designs the Exynos family of mobile processors, which handle core computing and graphics tasks in smartphones. The previous-generation Exynos 2600 powers select Galaxy S26 models and the Galaxy Z Flip8.

The Exynos 2700 is expected to be manufactured using Samsung's second-generation 2-nanometer foundry process, known as SF2P. The chip is also expected to feature an upgraded heat path block, packaging technology designed to improve heat dissipation and performance.

"Development of the Exynos 2700 is on track, with the aim of having it used in flagship models," Park Yong-in, president and head of system LSI business, said at a management briefing in June.


yeeun@heraldcorp.com