Samsung Electronics will unveil key technologies shaping its 2025 growth engines, including the highly anticipated HBM4 memory chip, at its annual in-house tech exhibition next week, industry sources said Monday.
The Samsung Tech Fair 2025, to be held Oct. 27-31 at the company’s Sporex complex in Yongin, Gyeonggi Province, will run under the theme “Reboot: Designing What’s Next.”
The event will gather major affiliates such as Samsung Advanced Institute of Technology, Samsung Research, Samsung Display, Samsung SDI, Samsung Electro-Mechanics and Samsung Biologics to share research and development priorities across three pillars: AI agents, sustainability and computing and networks.
Closed to the public, the exhibition will feature unreleased products and next-generation technologies. Samsung’s semiconductor division plans to introduce its 12-layer HBM4 chip, set for mass production by year-end. The chipmaker, which has been regaining ground in the AI memory race, is also preparing to begin HBM3E supplies to Nvidia.
Market tracker Counterpoint Research projects Samsung’s share in the global HBM market to climb from 17 percent in the second quarter of 2024 to around 30 percent next year as production expands.
The company is also expected to unveil a 200-megapixel image sensor — featuring the world’s smallest pixel technology — and AI solutions specialized for semiconductors.
Samsung Research, meanwhile, will present its vision for on-device AI agents designed to enhance the Galaxy ecosystem, while the display unit will debut a 115-inch Micro RGB TV to counter intensifying competition from Chinese rivals.
Launched in 2001, the annual tech fair serves as Samsung’s key platform for reinforcing groupwide R&D capabilities. The company’s R&D spending hit a record 18 trillion won ($12.7 billion) in the first half of this year.
herim@heraldcorp.com
