SK Hynix said Thursday that it would team up with AMD, a U.S. semiconductor company, in developing high-bandwidth 3-D stacked memory technologies and related products.
“The collaboration will be helpful for both firms as SK Hynix aims to commercialize HBM (high-bandwidth memory) in earnest, and AMD needs a high-speed and efficient product like this,” an SK Hynix official said.
The HBM can be utilized for graphic processing units and networking applications.
The agreement came after the two firms had a meeting at the annual 3-D Architectures for Semiconductor Integration and Packaging conference, held last week in California.
AMD’s 3-D program manager Bryan Black was quoted in news reports as saying, “Getting 3-D going will take a bold move, and AMD is ready to make that move.”
The Korean chipmaker is currently sampling the HBM memory and preparing for mass production.
