Samsung Electronics Co. said Wednesday it has started mass production of a one-package chip, which stacks a number of different smartphone parts together, enabling thinner handsets with bigger batteries.
  

The South Korea-based company, the world's largest maker of smartphones, used the ePoP (Embedded Package on Package) in its wearable devices released last year. 
  

The ePoP compresses core parts such as dynamic random access memory or NAND flash into one chip, which can reduce the space needed for such components by 40 percent, Samsung said.  Such packaging marks a technological breakthrough as heat-vulnerable NAND flash so far could not be put together with application processors that work under high temperatures.
  

Samsung said its latest ePoP for smartphones will come with a 3GB mobile DRAM and 32GB NAND.
  

"The ePoP for smartphones will provide an extra fast, energy-efficient, and slim solution by combining the 3GB-low power double data rate 3 DRAM and 32GB embedded Multi Media Card," Samsung said in its release. (Yonhap)